Publication:

Impact of mechanical stress on electrical performance of 3D NAND

Date

2019
Proceedings Paper
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dc.contributor.authorKruv, Anastasiia
dc.contributor.authorArreghini, Antonio
dc.contributor.authorGonzalez, Mario
dc.contributor.authorVerreck, Devin
dc.contributor.authorVan den Bosch, Geert
dc.contributor.authorDe Wolf, Ingrid
dc.contributor.authorFurnemont, Arnaud
dc.contributor.imecauthorKruv, Anastasiia
dc.contributor.imecauthorArreghini, Antonio
dc.contributor.imecauthorGonzalez, Mario
dc.contributor.imecauthorVerreck, Devin
dc.contributor.imecauthorVan den Bosch, Geert
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.imecauthorFurnemont, Arnaud
dc.contributor.orcidimecArreghini, Antonio::0000-0002-7493-9681
dc.contributor.orcidimecVerreck, Devin::0000-0002-3833-5880
dc.contributor.orcidimecVan den Bosch, Geert::0000-0001-9971-6954
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.contributor.orcidimecFurnemont, Arnaud::0000-0002-6378-1030
dc.date.accessioned2021-10-27T11:51:31Z
dc.date.available2021-10-27T11:51:31Z
dc.date.embargo9999-12-31
dc.date.issued2019
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/33342
dc.identifier.urlhttps://ieeexplore.ieee.org/document/8720410
dc.source.beginpage7C.2
dc.source.conference2019 IEEE International Reliability Physics Symposium - IRPS
dc.source.conferencedate31/03/2019
dc.source.conferencelocationMonterey, CA USA
dc.title

Impact of mechanical stress on electrical performance of 3D NAND

dc.typeProceedings paper
dspace.entity.typePublication
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