Publication:

"Hole-in-one TSV", a new via last concept for high density 3DSOC interconnects

Date

2018

Proceedings Paper

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Files

37077.pdf 1.24 MB

Author(s)

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Van Huylenbroeck, Stefaan

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Jamieson, Geraldine

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Tutunjyan, Nina

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Statistics

1993 since deposited on 2021-10-25

Acq. date: 2026-06-07