Publication:
"Hole-in-one TSV", a new via last concept for high density 3DSOC interconnects
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2001 since deposited on 2021-10-25
2last month
Acq. date: 2026-10-08
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Statistics
Views
2001 since deposited on 2021-10-25
2last month
Acq. date: 2026-10-08
Citations