Publication:
"Hole-in-one TSV", a new via last concept for high density 3DSOC interconnects
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1999 since deposited on 2021-10-25
5last month
Acq. date: 2026-08-10
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Statistics
Views
1999 since deposited on 2021-10-25
5last month
Acq. date: 2026-08-10
Citations