Publication:
"Hole-in-one TSV", a new via last concept for high density 3DSOC interconnects
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1987 since deposited on 2021-10-25
6last month
2last week
Acq. date: 2025-12-15
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Metrics
Views
1987 since deposited on 2021-10-25
6last month
2last week
Acq. date: 2025-12-15
Citations