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Influence of the novel anchor design on the shear strength of poly-SiGe thin film wafer level packages

Date

2010
Proceedings Paper
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dc.contributor.authorClaes, Gert
dc.contributor.authorSeveri, Simone
dc.contributor.authorVan Hoof, Rita
dc.contributor.authorDecoutere, Stefaan
dc.contributor.authorCelis, Jean-Pierre
dc.contributor.authorWitvrouw, Ann
dc.contributor.imecauthorSeveri, Simone
dc.contributor.imecauthorVan Hoof, Rita
dc.contributor.imecauthorDecoutere, Stefaan
dc.contributor.orcidimecDecoutere, Stefaan::0000-0001-6632-6239
dc.date.accessioned2021-10-18T15:37:12Z
dc.date.available2021-10-18T15:37:12Z
dc.date.issued2010
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/16879
dc.source.beginpage512
dc.source.conference23rd IEEE International Conference on Micro Electro Mechanical Systems - MEMS
dc.source.conferencedate24/01/2010
dc.source.conferencelocationHongKong China
dc.source.endpage515
dc.title

Influence of the novel anchor design on the shear strength of poly-SiGe thin film wafer level packages

dc.typeProceedings paper
dspace.entity.typePublication
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