Analysis of electromigration failure of nano-interconnects through a combination of modeling and experimental methods

dc.contributor.author	Ceric, Hajdin
dc.contributor.author	Zahedmanesh, Houman
dc.contributor.author	Croes, Kristof
dc.contributor.imecauthor	Zahedmanesh, Houman
dc.contributor.imecauthor	Croes, Kristof
dc.contributor.orcidimec	Croes, Kristof::0000-0002-3955-0638
dc.date.accessioned	2021-10-27T07:55:37Z
dc.date.available	2021-10-27T07:55:37Z
dc.date.issued	2019
dc.identifier.issn	0026-2714
dc.identifier.uri	https://imec-publications.be/handle/20.500.12860/32674
dc.identifier.url	https://doi.org/10.1016/j.microrel.2019.06.054
dc.source.beginpage	113362
dc.source.journal	Microelectronics Reliability
dc.source.volume	100-101
dc.title	Analysis of electromigration failure of nano-interconnects through a combination of modeling and experimental methods
dc.type	Journal article
dspace.entity.type	Publication
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