Publication:
Initial void characterization in 30nm wide polycrystalline Cu line using a local sense EM test structure
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1838 since deposited on 2021-10-20
3last month
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Acq. date: 2026-08-07
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Statistics
Views
1838 since deposited on 2021-10-20
3last month
1last week
Acq. date: 2026-08-07
Citations