Publication:
Electrodeposition for die-to-wafer very high-density interconnect
Date
| dc.contributor.author | Inoue, Fumihiro | |
| dc.contributor.imecauthor | Inoue, Fumihiro | |
| dc.date.accessioned | 2021-10-28T22:45:56Z | |
| dc.date.available | 2021-10-28T22:45:56Z | |
| dc.date.issued | 2020 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/35305 | |
| dc.identifier.url | https://iopscience.iop.org/article/10.1149/MA2020-02251786mtgabs | |
| dc.source.beginpage | 1786 | |
| dc.source.conference | PRiME2020. Symposium G05: Materials and Processes for Semiconductor, 2.5 and 3D, Chip Packaging, PCB, FPCB and Wafer Bonding 3 | |
| dc.source.conferencedate | 4/10/2020 | |
| dc.source.conferencelocation | Virtual Virtual | |
| dc.title | Electrodeposition for die-to-wafer very high-density interconnect | |
| dc.type | Meeting abstract | |
| dspace.entity.type | Publication | |
| Files | ||
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