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Multilayer thin film technology as an enabling technology for System-in-Package (SIP) and "above-IC" Processing

Date

2003
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dc.contributor.authorBeyne, Eric
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.accessioned2021-10-15T04:01:09Z
dc.date.available2021-10-15T04:01:09Z
dc.date.issued2003
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/7206
dc.source.conference2nd International Symposium on Microelectronics and Packaging - ISMP
dc.source.conferencedate23/09/2003
dc.source.conferencelocationSeoul Korea
dc.title

Multilayer thin film technology as an enabling technology for System-in-Package (SIP) and "above-IC" Processing

dc.typeOral presentation
dspace.entity.typePublication
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