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Integration and packaging MEMS directly above active CMOS
Publication:
Integration and packaging MEMS directly above active CMOS
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Date
2007
Proceedings Paper
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15951.pdf
175.31 KB
Basic data
APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Pieters, Philip
;
Qi, Dan
;
Witvrouw, Ann
Journal
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1863
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Acq. date: 2025-12-15
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Views
1863
since deposited on 2021-10-16
1
last month
Acq. date: 2025-12-15
Citations