Skip to content
Institutional repository
Communities & Collections
Browse all items
Scientific publications
Open knowledge
Log In
imec Publications
Conference contributions
Advanced modeling and simulation of Cu nano-interconnects reliability
Publication:
Advanced modeling and simulation of Cu nano-interconnects reliability
Copy permalink
Date
2019
Proceedings Paper
Simple item page
Full metadata
Statistics
Loading...
Loading...
Files
41253.pdf
496.59 KB
Basic data
APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Ceric, Hajdin
;
Zahedmanesh, Houman
Journal
Abstract
Description
Metrics
Views
1851
since deposited on 2021-10-27
Acq. date: 2025-12-15
Citations
Metrics
Views
1851
since deposited on 2021-10-27
Acq. date: 2025-12-15
Citations