Publication:
What's in space – Exploration and improvement of line/space defect inspection of fine-pitch redistribution layer for fan-out wafer level packaging
Date
| dc.contributor.author | Liebens, Maarten | |
| dc.contributor.author | Slabbekoorn, John | |
| dc.contributor.author | Miller, Andy | |
| dc.contributor.author | Beyne, Eric | |
| dc.contributor.author | Yeoh, Richard | |
| dc.contributor.author | Krah, T. | |
| dc.contributor.author | Vangal, A. | |
| dc.contributor.author | Hiebert, S. | |
| dc.contributor.author | Cross, A. | |
| dc.contributor.imecauthor | Liebens, Maarten | |
| dc.contributor.imecauthor | Slabbekoorn, John | |
| dc.contributor.imecauthor | Miller, Andy | |
| dc.contributor.imecauthor | Beyne, Eric | |
| dc.contributor.orcidimec | Beyne, Eric::0000-0002-3096-050X | |
| dc.contributor.orcidimec | Miller, Andy::0000-0001-7048-2242 | |
| dc.date.accessioned | 2021-10-27T12:44:06Z | |
| dc.date.available | 2021-10-27T12:44:06Z | |
| dc.date.issued | 2019 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/33449 | |
| dc.identifier.url | https://ieeexplore.ieee.org/document/8791791 | |
| dc.source.conference | 2019 30th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC) | |
| dc.source.conferencedate | 6/05/2019 | |
| dc.source.conferencelocation | Saratoga, NY USA | |
| dc.title | What's in space – Exploration and improvement of line/space defect inspection of fine-pitch redistribution layer for fan-out wafer level packaging | |
| dc.type | Meeting abstract | |
| dspace.entity.type | Publication | |
| Files | ||
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