Publication:

Metrology for monitoring and detecting process issues in a TSV module

Date

2014
Journal article
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dc.contributor.authorPhilipsen, Harold
dc.contributor.authorVandersmissen, Kevin
dc.contributor.authorCockburn, Andrew
dc.contributor.authorErickson, David
dc.contributor.authorDrijbooms, Chris
dc.contributor.authorMoussa, Alain
dc.contributor.authorBender, Hugo
dc.contributor.authorStruyf, Herbert
dc.contributor.imecauthorPhilipsen, Harold
dc.contributor.imecauthorVandersmissen, Kevin
dc.contributor.imecauthorCockburn, Andrew
dc.contributor.imecauthorDrijbooms, Chris
dc.contributor.imecauthorMoussa, Alain
dc.contributor.imecauthorBender, Hugo
dc.contributor.imecauthorStruyf, Herbert
dc.contributor.orcidimecPhilipsen, Harold::0000-0002-5029-1104
dc.date.accessioned2021-10-22T04:44:20Z
dc.date.available2021-10-22T04:44:20Z
dc.date.issued2014
dc.identifier.issn2162-8769
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/24384
dc.identifier.urlhttp://jss.ecsdl.org/content/3/6/Q109.figures-only?related-urls=yes&legid=jss;3/6/Q109
dc.source.beginpageQ109
dc.source.endpageQ119
dc.source.issue6
dc.source.journalECS Journal of Solid State Science and Technology
dc.source.volume3
dc.title

Metrology for monitoring and detecting process issues in a TSV module

dc.typeJournal article
dspace.entity.typePublication
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