Publication:
Chips with extra functionality: Combining MEMS and smart packaging
Date
| dc.contributor.author | Beyne, Eric | |
| dc.contributor.imecauthor | Beyne, Eric | |
| dc.contributor.orcidimec | Beyne, Eric::0000-0002-3096-050X | |
| dc.date.accessioned | 2021-10-17T21:23:27Z | |
| dc.date.available | 2021-10-17T21:23:27Z | |
| dc.date.issued | 2009 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/14994 | |
| dc.source.conference | 10th IMEC Executive Seminar | |
| dc.source.conferencedate | 9/11/2009 | |
| dc.source.conferencelocation | Tokyo Japan | |
| dc.title | Chips with extra functionality: Combining MEMS and smart packaging | |
| dc.type | Oral presentation | |
| dspace.entity.type | Publication | |
| Files | ||
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