Photonic flash soldering of thin chips and SMD components on foils for flexible electronics

dc.contributor.author	van den Ende, Daan
dc.contributor.author	Hendriks, Rob
dc.contributor.author	Cauchois, Romain
dc.contributor.author	Kusters, Roel H.L.
dc.contributor.author	Cauwe, Maarten
dc.contributor.author	Groen, Wilhelm
dc.contributor.author	van den Brand, Jeroen
dc.contributor.imecauthor	Cauwe, Maarten
dc.contributor.orcidimec	Cauwe, Maarten::0000-0002-6413-998X
dc.date.accessioned	2021-10-22T07:01:33Z
dc.date.available	2021-10-22T07:01:33Z
dc.date.embargo	9999-12-31
dc.date.issued	2014
dc.identifier.issn	2156-3950
dc.identifier.uri	https://imec-publications.be/handle/20.500.12860/24670
dc.identifier.url	http://ieeexplore.ieee.org/document/6923428/
dc.source.beginpage	1879
dc.source.endpage	1886
dc.source.issue	11
dc.source.journal	IEEE Transactions on Components, Packaging and Manufacturing Technology
dc.source.volume	4
dc.title	Photonic flash soldering of thin chips and SMD components on foils for flexible electronics
dc.type	Journal article
dspace.entity.type	Publication
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