Publication:

Ultra-low copper baths for sub-35 nm copper interconnects

Date

2013
Journal article
Simple item page Full metadata Statistics
 
dc.contributor.authorAtanasova, Tanya
dc.contributor.authorCarbonell, Laure
dc.contributor.authorCaluwaerts, Rudy
dc.contributor.authorTokei, Zsolt
dc.contributor.authorStrubbe, Katrien
dc.contributor.authorVereecken, Philippe
dc.contributor.imecauthorCaluwaerts, Rudy
dc.contributor.imecauthorTokei, Zsolt
dc.contributor.imecauthorVereecken, Philippe
dc.contributor.orcidimecVereecken, Philippe::0000-0003-4115-0075
dc.date.accessioned2021-10-21T06:43:24Z
dc.date.available2021-10-21T06:43:24Z
dc.date.embargo9999-12-31
dc.date.issued2013
dc.identifier.issn0013-4651
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/21996
dc.identifier.urlhttp://jes.ecsdl.org/content/160/12/D3255.abstract?etoc
dc.source.beginpageD3222
dc.source.endpageD3259
dc.source.issue12
dc.source.journalJournal of the Electrochemical Society
dc.source.volume160
dc.title

Ultra-low copper baths for sub-35 nm copper interconnects

dc.typeJournal article
dspace.entity.typePublication
Files

Original bundle

Name:
28011.pdf
Size:
801.42 KB
Format:
Adobe Portable Document Format
Download
Publication available in collections:
Articles