Publication:

Photonics-CMOS 3D integration: copper through-silicon-via approach

Date

2009
Proceedings Paper
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dc.contributor.authorMasood, Adil
dc.contributor.authorBogaerts, Wim
dc.contributor.authorVan Olmen, Jan
dc.contributor.authorVan Aelst, Joke
dc.contributor.authorVan Thourhout, Dries
dc.contributor.authorSabuncuoglu Tezcan, Deniz
dc.contributor.imecauthorMasood, Adil
dc.contributor.imecauthorBogaerts, Wim
dc.contributor.imecauthorVan Olmen, Jan
dc.contributor.imecauthorVan Aelst, Joke
dc.contributor.imecauthorVan Thourhout, Dries
dc.contributor.imecauthorSabuncuoglu Tezcan, Deniz
dc.contributor.orcidimecBogaerts, Wim::0000-0003-1112-8950
dc.contributor.orcidimecVan Thourhout, Dries::0000-0003-0111-431X
dc.contributor.orcidimecSabuncuoglu Tezcan, Deniz::0000-0002-9237-7862
dc.date.accessioned2021-10-18T00:41:15Z
dc.date.available2021-10-18T00:41:15Z
dc.date.embargo9999-12-31
dc.date.issued2009
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/15841
dc.source.beginpage165
dc.source.conference14th Annual Symposium of the IEEE Photonics Benelux Chapter
dc.source.conferencedate5/11/2009
dc.source.conferencelocationBrussels Belgium
dc.source.endpage168
dc.title

Photonics-CMOS 3D integration: copper through-silicon-via approach

dc.typeProceedings paper
dspace.entity.typePublication
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