Publication:

Leakage and TDDB Mechanisms in 18 nm Pitch Direct Metal Etch Ru Interconnects with Airgaps

Date

2025-01-01
Proceedings Paper
https://doi.org/10.1109/IRPS48204.2025.10982715
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dc.contributor.authorLesniewska, Alicja
dc.contributor.authorFang, Yu
dc.contributor.authorDelie, Gilles
dc.contributor.authorRoussel, Philippe
dc.contributor.authorVan Sever, Koen
dc.contributor.authorChery, Emmanuel
dc.contributor.authorVarela Pedreira, Olalla
dc.contributor.authorCiofi, Ivan
dc.contributor.authorPark, Seongho
dc.contributor.authorTokei, Zsolt
dc.contributor.authorCroes, Kristof
dc.date.accessioned2025-12-10T10:30:40Z
dc.date.available2025-12-10T10:30:40Z
dc.date.createdwos2025-10-18
dc.date.issued2025-01-01
dc.identifier.doi10.1109/IRPS48204.2025.10982715
dc.identifier.isbn979-8-3315-0478-6
dc.identifier.issn1541-7026
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/58534
dc.language.isoeng
dc.provenance.editstepusergreet.vanhoof@imec.be
dc.publisherIEEE
dc.source.conference2025 IEEE INTERNATIONAL RELIABILITY PHYSICS SYMPOSIUM, IRPS
dc.source.conferencedate2025-03-30
dc.source.conferencelocationMonterey
dc.source.journal2025 IEEE INTERNATIONAL RELIABILITY PHYSICS SYMPOSIUM, IRPS
dc.source.numberofpages6
dc.title

Leakage and TDDB Mechanisms in 18 nm Pitch Direct Metal Etch Ru Interconnects with Airgaps

dc.typeProceedings paper
dspace.entity.typePublication
imec.identified.statusLibrary
imec.internal.crawledAt2025-10-22
imec.internal.sourcecrawler
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