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MOCVD growth of DH-HEMT buffers with low-temperature AlN interlayer on 200 mm Si (111) substrate for breakdown voltage enhancement

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1922 since deposited on 2021-10-23
Acq. date: 2025-10-23

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1922 since deposited on 2021-10-23
Acq. date: 2025-10-23

Citations