Publication:

Interconnection and lamination technologies towards ubiquitous integration of photovoltaics

Date

2023-07
Journal article
https://doi.org/10.1002/pip.3730
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dc.contributor.authorGovaerts, Jonathan
dc.contributor.authorBorgers, Tom
dc.contributor.authorLuo, Bin
dc.contributor.authorVan Dyck, Rik
dc.contributor.authorvan Der Heide, Arvid
dc.contributor.authorReekmans, Bart
dc.contributor.authorVastmans, Luc
dc.contributor.authorMoors, Reinoud
dc.contributor.authorDoumen, Geert
dc.contributor.authorTous, Loic
dc.contributor.authorPoortmans, Jef
dc.contributor.imecauthorGovaerts, Jonathan
dc.contributor.imecauthorBorgers, Tom
dc.contributor.imecauthorLuo, Bin
dc.contributor.imecauthorVan Dyck, Rik
dc.contributor.imecauthorvan Der Heide, Arvid
dc.contributor.imecauthorReekmans, Bart
dc.contributor.imecauthorVastmans, Luc
dc.contributor.imecauthorMoors, Reinoud
dc.contributor.imecauthorDoumen, Geert
dc.contributor.imecauthorTous, Loic
dc.contributor.imecauthorPoortmans, Jef
dc.contributor.orcidimecGovaerts, Jonathan::0000-0002-8908-1198
dc.contributor.orcidimecBorgers, Tom::0000-0002-7878-6977
dc.contributor.orcidimecLuo, Bin::0000-0001-8919-3678
dc.contributor.orcidimecVan Dyck, Rik::0000-0003-3947-4361
dc.contributor.orcidimecvan der Heide, Arvid::0000-0002-7589-4526
dc.contributor.orcidimecReekmans, Bart::0000-0002-9712-9091
dc.contributor.orcidimecDoumen, Geert::0000-0002-8029-7507
dc.contributor.orcidimecTous, Loic::0000-0001-9928-7774
dc.contributor.orcidimecPoortmans, Jef::0000-0003-2077-2545
dc.date.accessioned2023-11-27T11:35:53Z
dc.date.available2023-07-30T17:28:51Z
dc.date.available2023-08-16T06:41:17Z
dc.date.available2023-11-27T11:35:53Z
dc.date.embargo2023-07-16
dc.date.issued2023-07
dc.description.wosFundingTextAgentschap Innoveren en Ondernemen; European Commission; Kuwait Foundation for the Advancement of Sciences, Grant/Award Number: P115-15EE-01; Flemish government; European Union's Horizon 2020 Programme, Grant/Award Number: 857793
dc.identifier.doi10.1002/pip.3730
dc.identifier.issn1062-7995
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/42245
dc.publisherWILEY
dc.source.beginpage1114
dc.source.endpage1129
dc.source.issue11
dc.source.journalPROGRESS IN PHOTOVOLTAICS
dc.source.numberofpages16
dc.source.volume31
dc.subject.keywordsMODULES
dc.title

Interconnection and lamination technologies towards ubiquitous integration of photovoltaics

dc.typeJournal article
dspace.entity.typePublication
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