Publication:

High density 20μm pitch CuSn microbump process for high-end 3D applications

Date

2011
Proceedings Paper
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dc.contributor.authorDe Vos, Joeri
dc.contributor.authorJourdain, Anne
dc.contributor.authorErismis, Mehmet Akif
dc.contributor.authorZhang, Wenqi
dc.contributor.authorDe Munck, Koen
dc.contributor.authorLa Manna, Antonio
dc.contributor.authorSabuncuoglu Tezcan, Deniz
dc.contributor.authorSoussan, Philippe
dc.contributor.imecauthorDe Vos, Joeri
dc.contributor.imecauthorJourdain, Anne
dc.contributor.imecauthorDe Munck, Koen
dc.contributor.imecauthorLa Manna, Antonio
dc.contributor.imecauthorSabuncuoglu Tezcan, Deniz
dc.contributor.imecauthorSoussan, Philippe
dc.contributor.orcidimecDe Vos, Joeri::0000-0002-9332-9336
dc.contributor.orcidimecSabuncuoglu Tezcan, Deniz::0000-0002-9237-7862
dc.contributor.orcidimecSoussan, Philippe::0000-0002-1347-6978
dc.contributor.orcidimecJourdain, Anne::0000-0002-7610-0513
dc.contributor.orcidimecDe Munck, Koen::0000-0003-0922-3860
dc.date.accessioned2021-10-19T13:09:20Z
dc.date.available2021-10-19T13:09:20Z
dc.date.issued2011
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/18808
dc.source.beginpage27
dc.source.conferenceIEEE 61st Electronic Components and Technology Conference - ECTC
dc.source.conferencedate31/05/2011
dc.source.conferencelocationLake Buena Vista, FL USA
dc.source.endpage31
dc.title

High density 20μm pitch CuSn microbump process for high-end 3D applications

dc.typeProceedings paper
dspace.entity.typePublication
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