Publication:

Improving solder wetting of micro bumps on metal pads using metallic or organic pad coatings

Date

2017
Proceedings Paper
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dc.contributor.authorDe Preter, Inge
dc.contributor.authorDerakhshandeh, Jaber
dc.contributor.authorBex, Pieter
dc.contributor.authorFodor, Ferenc
dc.contributor.authorCherman, Vladimir
dc.contributor.authorRebibis, Kenneth June
dc.contributor.authorMiller, Andy
dc.contributor.authorBeyer, Gerald
dc.contributor.authorBeyne, Eric
dc.contributor.imecauthorDe Preter, Inge
dc.contributor.imecauthorDerakhshandeh, Jaber
dc.contributor.imecauthorBex, Pieter
dc.contributor.imecauthorFodor, Ferenc
dc.contributor.imecauthorCherman, Vladimir
dc.contributor.imecauthorRebibis, Kenneth June
dc.contributor.imecauthorMiller, Andy
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecDerakhshandeh, Jaber::0000-0003-2448-9165
dc.contributor.orcidimecBex, Pieter::0000-0003-0896-2514
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.accessioned2021-10-24T03:53:57Z
dc.date.available2021-10-24T03:53:57Z
dc.date.embargo9999-12-31
dc.date.issued2017
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/28149
dc.identifier.urlhttp://ieeexplore.ieee.org/document/8309263/
dc.source.beginpage8.9
dc.source.conferenceIEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference - IEEE S3S
dc.source.conferencedate16/10/2017
dc.source.conferencelocationSan Francisco, CA USA
dc.title

Improving solder wetting of micro bumps on metal pads using metallic or organic pad coatings

dc.typeProceedings paper
dspace.entity.typePublication
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