Publication:
Impact of PCB-housing-interaction on QFN solder joint reliability
Date
| dc.contributor.author | Vandevelde, Bart | |
| dc.contributor.author | Labie, Riet | |
| dc.contributor.author | Vanderstraeten, Daniel | |
| dc.contributor.author | Blansaer, Eddy | |
| dc.contributor.imecauthor | Vandevelde, Bart | |
| dc.contributor.orcidimec | Vandevelde, Bart::0000-0002-6753-6438 | |
| dc.date.accessioned | 2022-01-12T11:03:31Z | |
| dc.date.available | 2021-11-02T16:04:46Z | |
| dc.date.available | 2022-01-12T11:03:31Z | |
| dc.date.issued | 2020 | |
| dc.identifier.eisbn | 978-1-7281-6049-8 | |
| dc.identifier.issn | na | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/38161 | |
| dc.publisher | IEEE | |
| dc.source.conference | 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) | |
| dc.source.conferencedate | JUL 05-08, 2020 | |
| dc.source.conferencelocation | Cracow | |
| dc.source.journal | na | |
| dc.source.numberofpages | 3 | |
| dc.title | Impact of PCB-housing-interaction on QFN solder joint reliability | |
| dc.type | Proceedings paper | |
| dspace.entity.type | Publication | |
| Files | ||
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