Publication:

Collective die-to-wafer bonding enabling low-loss evanescent coupling for optically interconnected System-on-Wafer

Date

2024
Proceedings Paper
https://doi.org/10.1364/OFC.2024.Tu3A.4
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Author(s)

Xu, Pengfei  
;
He, Junwen  
;
Kennes, Koen  
;
Dvoretskii, Anton  
;
Podpod, Arnita  
;
Lepage, Guy  
;
Golshani, Negin  
;
Magdziak, Rafal  
;
Bipul, Swetanshu  
;
Bode, Dieter  
;
Verheyen, Peter  
;
Chakrabarti, Maumita  
;
Velenis, Dimitrios  
;
Miller, Andy  
;
Ban, Yoojin  
;
Ferraro, Filippo  
;
Van Campenhout, Joris  

Journal

N/A

Abstract

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310 since deposited on 2024-10-17
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Acq. date: 2026-02-19

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310 since deposited on 2024-10-17
5last month
Acq. date: 2026-02-19

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