Publication:

Effects of He plasma pre-treatment on low-k damage during post Cu surface ceaning with NH3 plasma

Date

2010
Journal article
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dc.contributor.authorUrbanowicz, Adam
dc.contributor.authorShamiryan, Denis
dc.contributor.authorZaka, Alban
dc.contributor.authorVerdonck, Patrick
dc.contributor.authorDe Gendt, Stefan
dc.contributor.authorBaklanov, Mikhaïl
dc.contributor.imecauthorVerdonck, Patrick
dc.contributor.imecauthorDe Gendt, Stefan
dc.contributor.orcidimecVerdonck, Patrick::0000-0003-2454-0602
dc.contributor.orcidimecDe Gendt, Stefan::0000-0003-3775-3578
dc.date.accessioned2021-10-18T22:34:09Z
dc.date.available2021-10-18T22:34:09Z
dc.date.issued2010
dc.identifier.issn0013-4651
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/18115
dc.source.beginpageH565
dc.source.endpageH573
dc.source.issue5
dc.source.journalJournal of the Electrochemical Society
dc.source.volume157
dc.title

Effects of He plasma pre-treatment on low-k damage during post Cu surface ceaning with NH3 plasma

dc.typeJournal article
dspace.entity.typePublication
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