Publication:

RF modelling and characterization of TSVs and inductive links of hybrid bonded devices

Date

2024

Proceedings Paper

https://doi.org/10.1109/ECTC51529.2024.00123

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Author(s)

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Chen, Shih-Hung

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Journal

N/A

Statistics

247 since deposited on 2024-12-07

Acq. date: 2026-02-25