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Conference contributions
RF modelling and characterization of TSVs and inductive links of hybrid bonded devices
Publication:
RF modelling and characterization of TSVs and inductive links of hybrid bonded devices
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Date
2024
Proceedings Paper
https://doi.org/10.1109/ECTC51529.2024.00123
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Sun, Xiao
;
Su, Chin-Ya
;
Chen, Shih-Hung
;
Chew, Soon Aik
;
Zhang, Boyao
;
Beyne, Eric
Journal
N/A
Abstract
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241
since deposited on 2024-12-07
Acq. date: 2025-12-15
Citations
Metrics
Views
241
since deposited on 2024-12-07
Acq. date: 2025-12-15
Citations