Publication:

Building blocks of a flip-chip integrated superconducting quantum processor

Date

2022
Journal article
https://doi.org/10.1088/2058-9565/ac734b
Simple item page Full metadata Statistics
 
dc.contributor.authorKosen, Sandoko
dc.contributor.authorLi, Hang-Xi
dc.contributor.authorRommel, Marcus
dc.contributor.authorShiri, Daryoush
dc.contributor.authorWarren, Christopher
dc.contributor.authorGronberg, Leif
dc.contributor.authorSalonen, Jaakko
dc.contributor.authorAbad, Tahereh
dc.contributor.authorBiznarova, Janka
dc.contributor.authorCaputo, Marco
dc.contributor.authorChen, Liangyu
dc.contributor.authorGrigoras, Kestutis
dc.contributor.authorJohansson, Goran
dc.contributor.authorKockum, Anton Frisk
dc.contributor.authorKrizan, Christian
dc.contributor.authorPerez Lozano, Daniel
dc.contributor.authorNorris, Graham J.
dc.contributor.authorOsman, Amr
dc.contributor.authorFernandez-Pendas, Jorge
dc.contributor.authorRonzani, Alberto
dc.contributor.imecauthorPerez Lozano, Daniel
dc.contributor.orcidimecPerez Lozano, Daniel::0000-0003-3098-3266
dc.date.accessioned2022-09-02T09:50:41Z
dc.date.available2022-06-19T02:21:21Z
dc.date.available2022-09-02T09:50:41Z
dc.date.issued2022
dc.description.wosFundingTextWe acknowledge the use of support and resources from Myfab Chalmers, and Chalmers Centre for Computational Science and Engineering (C3SE, partially funded by the Swedish Research Council through Grant Agreement No. 2018-05973). This work was funded by the EU Flagship on Quantum Technology H2020-FETFLAG-2018-03 project 820363 OpenSuperQ and by the Knut and Alice Wallenberg (KAW) Foundation through the Wallenberg Centre for Quantum Technology (WACQT).
dc.identifier.doi10.1088/2058-9565/ac734b
dc.identifier.issn2058-9565
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/39979
dc.publisherIOP Publishing Ltd
dc.source.beginpage035018
dc.source.issue3
dc.source.journalQUANTUM SCIENCE AND TECHNOLOGY
dc.source.numberofpages9
dc.source.volume7
dc.subject.keywordsQUBITS
dc.title

Building blocks of a flip-chip integrated superconducting quantum processor

dc.typeJournal article
dspace.entity.typePublication
Files

Original bundle

Name:
Kosen_2022_Quantum_Sci._Technol._7_035018.pdf
Size:
3.11 MB
Format:
Adobe Portable Document Format
Description:
Published version
Download
Publication available in collections:
Articles