Publication:

Process development and characterization of 3D multi-die stacking

Date

2020
Proceedings Paper
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dc.contributor.authorGerets, Carine
dc.contributor.authorDerakhshandeh, Aber
dc.contributor.authorBex, Pieter
dc.contributor.authorLofrano, Melina
dc.contributor.authorCherman, Vladimir
dc.contributor.authorFodor, Ferenc
dc.contributor.authorDe Wolf, Ingrid
dc.contributor.authorRebibis, Kenneth June
dc.contributor.authorBeyer, Gerald
dc.contributor.authorMiller, Andy
dc.contributor.authorBeyne, Eric
dc.contributor.imecauthorGerets, Carine
dc.contributor.imecauthorDerakhshandeh, Aber
dc.contributor.imecauthorBex, Pieter
dc.contributor.imecauthorLofrano, Melina
dc.contributor.imecauthorCherman, Vladimir
dc.contributor.imecauthorFodor, Ferenc
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.imecauthorRebibis, Kenneth June
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorMiller, Andy
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecBex, Pieter::0000-0003-0896-2514
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.accessioned2022-01-20T10:13:28Z
dc.date.available2021-11-02T16:03:21Z
dc.date.available2022-01-20T10:13:28Z
dc.date.issued2020
dc.identifier.eisbn978-1-7281-6293-5
dc.identifier.issnna
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/38046
dc.publisherIEEE
dc.source.conference8th IEEE Electronics System-Integration Technology Conference (ESTC)
dc.source.conferencedateSEP 15-18, 2020
dc.source.conferencelocationVestfold
dc.source.journalna
dc.source.numberofpages6
dc.title

Process development and characterization of 3D multi-die stacking

dc.typeProceedings paper
dspace.entity.typePublication
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