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Post-CMP cleaners for tungsten advanced nodes: 10 nm and 7 nm

Date

2017-10
Proceedings Paper
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dc.contributor.authorLieten, Ruben
dc.contributor.authorWhite, Daniela
dc.contributor.authorParson, Thomas
dc.contributor.authorJenq, Shining
dc.contributor.authorFrye, Don
dc.contributor.authorWhite, Michael
dc.contributor.authorTeugels, Lieve
dc.contributor.authorStruyf, Herbert
dc.contributor.imecauthorLieten, Ruben
dc.contributor.imecauthorParson, Thomas
dc.contributor.imecauthorTeugels, Lieve
dc.contributor.imecauthorStruyf, Herbert
dc.contributor.orcidimecTeugels, Lieve::0000-0002-6613-9414
dc.date.accessioned2021-10-24T08:00:51Z
dc.date.available2021-10-24T08:00:51Z
dc.date.issued2017-10
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/28827
dc.source.conferenceInternational Conference on Planarization Technology - ICPT
dc.source.conferencedate11/10/2017
dc.source.conferencelocationLeuven Belgium
dc.title

Post-CMP cleaners for tungsten advanced nodes: 10 nm and 7 nm

dc.typeProceedings paper
dspace.entity.typePublication
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