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Advancing SEM Based Nano-scale Defect Analysis in Semiconductor Manufacturing for Advanced IC Nodes

 
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cris.virtual.orcid0000-0002-6314-2685
cris.virtual.orcid0000-0003-3775-3578
cris.virtual.orcid0000-0003-4308-0381
cris.virtual.orcid0000-0002-0886-137X
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cris.virtualsource.department1fc7b9f7-9367-45d8-be12-90bcb20ebcbd
cris.virtualsource.department1fd77399-4d0a-4004-8a7f-9634c67c90de
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cris.virtualsource.department618c7dcf-d19e-467b-8ef0-ea4d90b44eb8
cris.virtualsource.departmentded48b9e-1c01-4640-8129-f853236f5a13
cris.virtualsource.orcid1fc7b9f7-9367-45d8-be12-90bcb20ebcbd
cris.virtualsource.orcid1fd77399-4d0a-4004-8a7f-9634c67c90de
cris.virtualsource.orcid88d4cdb2-8ec4-4aa4-87ee-9719850d7416
cris.virtualsource.orcid618c7dcf-d19e-467b-8ef0-ea4d90b44eb8
cris.virtualsource.orcidded48b9e-1c01-4640-8129-f853236f5a13
dc.contributor.authorDey, Bappaditya
dc.contributor.authorMonden, Matthias
dc.contributor.authorBlanco, Victor
dc.contributor.authorHalder, Sandip
dc.contributor.authorDe Gendt, Stefan
dc.date.accessioned2026-05-28T15:01:16Z
dc.date.available2026-05-28T15:01:16Z
dc.date.createdwos2025-09-13
dc.date.issued2025
dc.description.abstractIn this research, we introduce a unified end-to-end Automated Defect Classification-Detection-Segmentation (ADCDS) framework for classifying, detecting, and segmenting multiple instances of semiconductor defects for advanced nodes. This framework consists of two modules: (a) a defect detection module, followed by (b) a defect segmentation module. The defect detection module employs Deformable DETR to aid in the classification and detection of nano-scale defects, while the segmentation module utilizes BoxSnake. BoxSnake facilitates box-supervised instance segmentation of nano-scale defects, supported by the former module. This simplifies the process by eliminating the laborious requirement for ground-truth pixel-wise mask annotation by human experts, which is typically associated with training conventional segmentation models. We have evaluated the performance of our ADCDS framework using two distinct process datasets from real wafers, as ADI and AEI, specifically focusing on Line-space patterns. We have demonstrated the applicability and significance of our proposed methodology, particularly in the nano-scale segmentation and generation of binary defect masks, using the challenging ADI SEM dataset where ground-truth pixel-wise segmentation annotations were unavailable. Furthermore, we have presented a comparative analysis of our proposed framework against previous approaches to demonstrate its effectiveness. Our proposed framework achieved an overall mAP@IoU0.5 of 72.19 for detection and 78.86 for segmentation on the ADI dataset. Similarly, for the AEI dataset, these metrics were 90.38 for detection and 95.48 for segmentation. Thus, our proposed framework effectively fulfils the requirements of advanced defect analysis while addressing significant constraints.
dc.identifier.doi10.1007/978-3-031-92805-5_15
dc.identifier.isbn978-3-031-92804-8
dc.identifier.issn0302-9743
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/59483
dc.language.isoeng
dc.provenance.editstepusergreet.vanhoof@imec.be
dc.publisherSPRINGER INTERNATIONAL PUBLISHING AG
dc.source.beginpage228
dc.source.conferenceComputer Vision – ECCV 2024 Workshops
dc.source.conferencedate2024-10-29
dc.source.conferencelocationMilano
dc.source.endpage243
dc.source.journalCOMPUTER VISION-ECCV 2024 WORKSHOPS, PT IV
dc.source.numberofpages16
dc.title

Advancing SEM Based Nano-scale Defect Analysis in Semiconductor Manufacturing for Advanced IC Nodes

dc.typeProceedings paper
dspace.entity.typePublication
imec.internal.crawledAt2025-10-22
imec.internal.sourcecrawler
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