Publication:

Cu-Cu bonding alternative to solder based micro-bumping

Date

2007
Proceedings Paper
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dc.contributor.authorRuythooren, Wouter
dc.contributor.authorBeltran Amenabar, Amaia
dc.contributor.authorLabie, Riet
dc.contributor.imecauthorRuythooren, Wouter
dc.contributor.imecauthorLabie, Riet
dc.contributor.orcidimecLabie, Riet::0000-0002-1401-1291
dc.date.accessioned2021-10-16T19:17:13Z
dc.date.available2021-10-16T19:17:13Z
dc.date.embargo9999-12-31
dc.date.issued2007
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/12823
dc.source.beginpage315
dc.source.conference9th Electronics Packaging Technology Conference - EPTC
dc.source.conferencedate10/12/2007
dc.source.conferencelocationSingapore
dc.source.endpage318
dc.title

Cu-Cu bonding alternative to solder based micro-bumping

dc.typeProceedings paper
dspace.entity.typePublication
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