Publication:
Study on Process Induced out-of-plane deformation for Fan-Out Wafer Level Packaging
Date
| dc.contributor.author | Salahouelhadj, Abdellah | |
| dc.contributor.author | Gonzalez, Mario | |
| dc.contributor.author | Podpod, Arnita | |
| dc.contributor.author | Beyne, Eric | |
| dc.contributor.imecauthor | Salahouelhadj, A. | |
| dc.contributor.imecauthor | Gonzalez, M. | |
| dc.contributor.imecauthor | Podpod, A. | |
| dc.contributor.imecauthor | Beyne, E. | |
| dc.contributor.imecauthor | Salahouelhadj, Abdellah | |
| dc.contributor.imecauthor | Gonzalez, Mario | |
| dc.contributor.imecauthor | Podpod, Arnita | |
| dc.contributor.imecauthor | Beyne, Eric | |
| dc.contributor.orcidimec | Salahouelhadj, Abdellah::0000-0002-3795-1446 | |
| dc.contributor.orcidimec | Gonzalez, Mario::0000-0003-4374-4854 | |
| dc.contributor.orcidimec | Beyne, Eric::0000-0002-3096-050X | |
| dc.date.accessioned | 2021-12-08T10:50:11Z | |
| dc.date.available | 2021-11-02T16:03:21Z | |
| dc.date.available | 2021-12-08T10:50:11Z | |
| dc.date.issued | 2020 | |
| dc.identifier.eisbn | 978-1-7281-6293-5 | |
| dc.identifier.issn | na | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/38045 | |
| dc.publisher | IEEE | |
| dc.source.conference | 8th IEEE Electronics System-Integration Technology Conference (ESTC) | |
| dc.source.conferencedate | SEP 15-18, 2020 | |
| dc.source.conferencelocation | Vestfold | |
| dc.source.journal | na | |
| dc.source.numberofpages | 5 | |
| dc.subject.keywords | DENSITY | |
| dc.title | Study on Process Induced out-of-plane deformation for Fan-Out Wafer Level Packaging | |
| dc.type | Proceedings paper | |
| dspace.entity.type | Publication | |
| Files | ||
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