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The use of ozonated water as a resist strip and post ash clean in a production fab

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dc.contributor.authorVroom, R.
dc.contributor.authorDe Gendt, Stefan
dc.contributor.imecauthorDe Gendt, Stefan
dc.contributor.orcidimecDe Gendt, Stefan::0000-0003-3775-3578
dc.date.accessioned2021-10-14T11:56:19Z
dc.date.available2021-10-14T11:56:19Z
dc.date.embargo9999-12-31
dc.date.issued1999
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/4015
dc.source.beginpage165
dc.source.conferenceProceedings 1999 IEEE International Symposium on Semiconductor Manufacturing Conference
dc.source.conferencedate11/10/1999
dc.source.conferencelocationSanta Clara, CA USA
dc.source.endpage168
dc.title

The use of ozonated water as a resist strip and post ash clean in a production fab

dc.typeProceedings paper
dspace.entity.typePublication
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