Publication:

A Modeling Study on Electrical and Thermal Behavior of CNT TSV for Multilayer Structure

Date

2023
Journal article
https://doi.org/10.1109/TED.2023.3297078
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dc.contributor.authorXu, Baohui
dc.contributor.authorChen, Rongmei
dc.contributor.authorZhou, Jiuren
dc.contributor.authorLiang, Jie
dc.contributor.imecauthorChen, Rongmei
dc.date.accessioned2023-12-07T11:15:15Z
dc.date.available2023-08-17T17:23:04Z
dc.date.available2023-12-07T11:15:15Z
dc.date.issued2023
dc.description.wosFundingTextThis work was supported in part by the National Natural Science Foundation of China under Grant 62104138.& nbsp;
dc.identifier.doi10.1109/TED.2023.3297078
dc.identifier.issn0018-9383
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/42338
dc.publisherIEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
dc.source.beginpage4779
dc.source.endpage4785
dc.source.issue9
dc.source.journalIEEE TRANSACTIONS ON ELECTRON DEVICES
dc.source.numberofpages7
dc.source.volume70
dc.subject.keywordsTEMPERATURE-COEFFICIENT
dc.subject.keywordsPERFORMANCE ANALYSIS
dc.subject.keywordsCARBON
dc.subject.keywordsSILICON
dc.subject.keywordsINTERCONNECTS
dc.subject.keywordsINTEGRATION
dc.subject.keywordsRESISTANCE
dc.title

A Modeling Study on Electrical and Thermal Behavior of CNT TSV for Multilayer Structure

dc.typeJournal article
dspace.entity.typePublication
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