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Ni(Pt) silicide with improved thermal stability for application in DRAM PERI or RMG devices

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dc.contributor.authorSchram, Tom
dc.contributor.authorSpessot, Alessio
dc.contributor.authorRitzenthaler, Romain
dc.contributor.authorRosseel, Erik
dc.contributor.authorCaillat, Christian
dc.contributor.authorHoriguchi, Naoto
dc.contributor.authorFazan, Pierre
dc.contributor.imecauthorSchram, Tom
dc.contributor.imecauthorSpessot, Alessio
dc.contributor.imecauthorRitzenthaler, Romain
dc.contributor.imecauthorRosseel, Erik
dc.contributor.imecauthorHoriguchi, Naoto
dc.contributor.imecauthorFazan, Pierre
dc.contributor.orcidimecSchram, Tom::0000-0003-1533-7055
dc.contributor.orcidimecRitzenthaler, Romain::0000-0002-8615-3272
dc.contributor.orcidimecHoriguchi, Naoto::0000-0001-5490-0416
dc.date.accessioned2021-10-21T11:49:54Z
dc.date.available2021-10-21T11:49:54Z
dc.date.embargo9999-12-31
dc.date.issued2013
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/23053
dc.source.beginpage189
dc.source.conferenceMaterials for Advanced Metallization - MAM
dc.source.conferencedate10/03/2013
dc.source.conferencelocationLeuven Belgium
dc.source.endpage190
dc.title

Ni(Pt) silicide with improved thermal stability for application in DRAM PERI or RMG devices

dc.typeMeeting abstract
dspace.entity.typePublication
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