Publication:
Impact of intermetallic formation and electro-migration on the integrity of bumped Cu/low-k Die
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1978 since deposited on 2021-10-15
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Acq. date: 2026-08-06
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Statistics
Views
1978 since deposited on 2021-10-15
1last month
1last week
Acq. date: 2026-08-06
Citations