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Impact of intermetallic formation and electro-migration on the integrity of bumped Cu/low-k Die
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1976 since deposited on 2021-10-15
1last month
Acq. date: 2025-12-10
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Metrics
Views
1976 since deposited on 2021-10-15
1last month
Acq. date: 2025-12-10
Citations