The vacuum wafer bonding technique as an alternative method for the fabrication of metal/semiconductor heterostructures

Publication:

2000

Presentation

Author(s)

Dessein, Kristof

;

Anil Kumar, P. S.

;

;

Delaey, L.

;

;

2003 since deposited on 2021-10-14

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Acq. date: 2026-09-15