Skip to content
Institutional repository
Communities & Collections
Browse
Site
Log In
imec Publications
Presentations
The vacuum wafer bonding technique as an alternative method for the fabrication of metal/semiconductor heterostructures
Publication:
The vacuum wafer bonding technique as an alternative method for the fabrication of metal/semiconductor heterostructures
Date
2000
Presentation
Simple item page
Full metadata
Statistics
Loading...
Loading...
Basic data
APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Dessein, Kristof
;
Anil Kumar, P. S.
;
Nemeth, Stefan
;
Delaey, L.
;
Borghs, Gustaaf
;
De Boeck, Jo
Journal
Abstract
Description
Metrics
Views
1992
since deposited on 2021-10-14
Acq. date: 2025-10-23
Citations
Metrics
Views
1992
since deposited on 2021-10-14
Acq. date: 2025-10-23
Citations