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Cleaning and strip requirements for metal gate based CMOS integration

Date

2009
Proceedings Paper
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dc.contributor.authorSchram, Tom
dc.contributor.authorSebaai, Farid
dc.contributor.authorClaes, Martine
dc.contributor.authorVos, Rita
dc.contributor.authorWada, Masayuki
dc.contributor.authorAlbert, Johan
dc.contributor.authorRohr, Erika
dc.contributor.authorKubicek, Stefan
dc.contributor.imecauthorSchram, Tom
dc.contributor.imecauthorSebaai, Farid
dc.contributor.imecauthorClaes, Martine
dc.contributor.imecauthorVos, Rita
dc.contributor.imecauthorKubicek, Stefan
dc.date.accessioned2021-10-18T02:45:00Z
dc.date.available2021-10-18T02:45:00Z
dc.date.issued2009
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/16179
dc.source.beginpage17
dc.source.conferenceCleaning and Surface Conditioning Technology in Semiconductor Device Manufacturing 11
dc.source.conferencedate4/10/2009
dc.source.conferencelocationVienna austria
dc.source.endpage28
dc.title

Cleaning and strip requirements for metal gate based CMOS integration

dc.typeProceedings paper
dspace.entity.typePublication
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