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Articles
Modeling differential via holes
Publication:
Modeling differential via holes
Date
2001
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Basic data
APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Laermans, Eric
;
De Geest, Jan
;
De Zutter, Daniel
;
Olyslager, Frank
;
Sercu, Stefaan
;
Morlion, D.
Journal
IEEE Trans. Advanced Packaging
Abstract
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1989
since deposited on 2021-10-14
Acq. date: 2025-10-24
Citations
Metrics
Views
1989
since deposited on 2021-10-14
Acq. date: 2025-10-24
Citations