Publication:

Changing superfilling mode for copper electrodeposition in blind holes from differential inhibition to differential acceleration

Date

2009
Journal article
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dc.contributor.authorLuhn, Ole
dc.contributor.authorRadisic, Alex
dc.contributor.authorVereecken, Philippe
dc.contributor.authorVan Hoof, Chris
dc.contributor.authorRuythooren, Wouter
dc.contributor.authorCelis, Jean-Pierre
dc.contributor.imecauthorRadisic, Alex
dc.contributor.imecauthorVereecken, Philippe
dc.contributor.imecauthorVan Hoof, Chris
dc.contributor.imecauthorRuythooren, Wouter
dc.contributor.orcidimecVereecken, Philippe::0000-0003-4115-0075
dc.date.accessioned2021-10-18T00:18:03Z
dc.date.available2021-10-18T00:18:03Z
dc.date.embargo9999-12-31
dc.date.issued2009
dc.identifier.issn1099-0062
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/15767
dc.source.beginpageD39
dc.source.endpageD41
dc.source.issue5
dc.source.journalElectrochemical and Solid-State Letters
dc.source.volume12
dc.title

Changing superfilling mode for copper electrodeposition in blind holes from differential inhibition to differential acceleration

dc.typeJournal article
dspace.entity.typePublication
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