Publication:
Challenges in testing TSV-based 3D stacked ICs: test flows, test contents, and test access
Date
| dc.contributor.author | Marinissen, Erik Jan | |
| dc.contributor.imecauthor | Marinissen, Erik Jan | |
| dc.contributor.orcidimec | Marinissen, Erik Jan::0000-0002-5058-8303 | |
| dc.date.accessioned | 2021-10-18T18:49:32Z | |
| dc.date.available | 2021-10-18T18:49:32Z | |
| dc.date.issued | 2010-12 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/17581 | |
| dc.source.beginpage | 544 | |
| dc.source.conference | IEEE Asia Pacific Conference on Circuits and Systems - APCCAS | |
| dc.source.conferencedate | 6/12/2010 | |
| dc.source.conferencelocation | Kuala Lumpur Malaysia | |
| dc.source.endpage | 547 | |
| dc.title | Challenges in testing TSV-based 3D stacked ICs: test flows, test contents, and test access | |
| dc.type | Proceedings paper | |
| dspace.entity.type | Publication | |
| Files | ||
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