Publication:
Overlay challenges in 3D heterogeneous integration
| dc.contributor.author | Grauer, Yoav | |
| dc.contributor.author | Miller, Andy | |
| dc.contributor.author | La Tulipe, Douglas Charles | |
| dc.contributor.author | Manassen, Amnon | |
| dc.contributor.author | Eisenbach, Shlomo | |
| dc.contributor.author | Bachar, Ohad | |
| dc.contributor.author | Gronheid, Roel | |
| dc.contributor.imecauthor | Miller, Andy | |
| dc.contributor.imecauthor | La Tulipe, Douglas Charles | |
| dc.contributor.orcidimec | Miller, Andy::0000-0001-7048-2242 | |
| dc.date.accessioned | 2023-06-08T09:35:42Z | |
| dc.date.available | 2022-09-08T02:39:17Z | |
| dc.date.available | 2023-06-08T09:35:42Z | |
| dc.date.issued | 2022 | |
| dc.description.wosFundingText | The authors wish to acknowledge the support of their work from ECSEL-JU project IT2 under grant agreement 875999 and the contribution of multiple colleagues at KLA: Oreste Donzella, Chet Lenox, Vinayak Pandey, Kara Sherman, Franz Zach, Motti Penia, Arkady Simkin, Dror Elka, Avner Safrani, Eitan Hajaj, and others. | |
| dc.identifier.doi | 10.1117/12.2608319 | |
| dc.identifier.eisbn | 978-1-5106-4982-8 | |
| dc.identifier.isbn | 978-1-5106-4981-1 | |
| dc.identifier.issn | 0277-786X | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/40384 | |
| dc.publisher | SPIE-INT SOC OPTICAL ENGINEERING | |
| dc.source.beginpage | Art. 120530D | |
| dc.source.conference | Conference on Metrology, Inspection, and Process Control XXXVI Part of SPIE Advanced Lithography and Patterning Conference | |
| dc.source.conferencedate | FEB 24-MAY 27, 2022 | |
| dc.source.conferencelocation | San Jose | |
| dc.source.journal | Proceedings of SPIE | |
| dc.source.numberofpages | 17 | |
| dc.source.volume | 12053 | |
| dc.title | Overlay challenges in 3D heterogeneous integration | |
| dc.type | Proceedings paper | |
| dspace.entity.type | Publication | |
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