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Integration of low-k dielectric films in damascene processes

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dc.contributor.authorHoofman, Romano
dc.contributor.authorNguyen Hoang, Viet
dc.contributor.authorArnal, V.
dc.contributor.authorBroekaart, M.
dc.contributor.authorGosset, L.G.
dc.contributor.authorBesling, W.F.A.
dc.contributor.authorFayolle, M.
dc.contributor.authorIacopi, Francesca
dc.contributor.imecauthorHoofman, Romano
dc.contributor.orcidimecHoofman, Romano::0000-0001-8740-104X
dc.date.accessioned2021-10-16T16:42:26Z
dc.date.available2021-10-16T16:42:26Z
dc.date.issued2007
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/12305
dc.source.beginpage199
dc.source.bookDielectric Films for Advanced Microelectronics
dc.source.endpage250
dc.title

Integration of low-k dielectric films in damascene processes

dc.typeBook chapter
dspace.entity.typePublication
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