Publication:

IC-package interaction

Date

2013
Proceedings Paper
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dc.contributor.authorVandevelde, Bart
dc.contributor.authorIvankovic, Andrej
dc.contributor.authorDebecker, Bjorn
dc.contributor.authorLofrano, Melina
dc.contributor.authorVanstreels, Kris
dc.contributor.authorGuo, Wei
dc.contributor.authorCherman, Vladimir
dc.contributor.authorGonzalez, Mario
dc.contributor.authorVan der Plas, Geert
dc.contributor.authorDe Wolf, Ingrid
dc.contributor.authorBeyne, Eric
dc.contributor.authorTokei, Zsolt
dc.contributor.imecauthorVandevelde, Bart
dc.contributor.imecauthorLofrano, Melina
dc.contributor.imecauthorVanstreels, Kris
dc.contributor.imecauthorGuo, Wei
dc.contributor.imecauthorCherman, Vladimir
dc.contributor.imecauthorGonzalez, Mario
dc.contributor.imecauthorVan der Plas, Geert
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.imecauthorBeyne, Eric
dc.contributor.imecauthorTokei, Zsolt
dc.contributor.orcidimecVandevelde, Bart::0000-0002-6753-6438
dc.contributor.orcidimecVanstreels, Kris::0000-0002-4420-0966
dc.contributor.orcidimecVan der Plas, Geert::0000-0002-4975-6672
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.accessioned2021-10-21T13:43:21Z
dc.date.available2021-10-21T13:43:21Z
dc.date.issued2013
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/23290
dc.source.conferenceIEEE Int. Conf on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsyst. - EuroSimE
dc.source.conferencedate14/04/2013
dc.source.conferencelocationWroclaw Poland
dc.title

IC-package interaction

dc.typeProceedings paper
dspace.entity.typePublication
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