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Thin MEMS packages obtained by a novel collective cap transfer process

Date

2011
Proceedings Paper
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dc.contributor.authorPhommahaxay, Alain
dc.contributor.authorBogaerts, Lieve
dc.contributor.authorNaito, Yasuyuki
dc.contributor.authorVan Cauwenberghe, Marc
dc.contributor.authorTutunjyan, Nina
dc.contributor.authorOnishi, Keiji
dc.contributor.authorTilmans, Harrie
dc.contributor.imecauthorPhommahaxay, Alain
dc.contributor.imecauthorBogaerts, Lieve
dc.contributor.imecauthorVan Cauwenberghe, Marc
dc.contributor.imecauthorTutunjyan, Nina
dc.contributor.imecauthorTilmans, Harrie
dc.contributor.orcidimecTilmans, Harrie::0000-0003-4240-4962
dc.date.accessioned2021-10-19T17:20:36Z
dc.date.available2021-10-19T17:20:36Z
dc.date.embargo9999-12-31
dc.date.issued2011
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/19575
dc.source.beginpage1505
dc.source.conferenceEurosensors XXV
dc.source.conferencedate4/09/2011
dc.source.conferencelocationAthens Greece
dc.source.endpage1508
dc.title

Thin MEMS packages obtained by a novel collective cap transfer process

dc.typeProceedings paper
dspace.entity.typePublication
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