Recommendations to further improvements of HBM ESD component level test specifications

Abstract

The goal of this paper is to provide data and discussion to help the ESD testing community come to a single and improved HBM ESD component level testing standard. The differences in the ESD Association and the JEDEC HBM testing procedures (/spl sim/qualification) and tester specifications (/spl sim/test result reproducibility) are investigated. A reduction of the test time-and thus cost-by a factor of 30 to ultimately 300, is addressed and justified. A future issue, the definition of HBM waveform envelopes to replace HBM waveform specifications, is addressed and a viable solution is offered.