The effect of the passivation material on the stress and stress relaxation behaviour of narrow Al-Si-Cu lines

dc.contributor.author	Witvrouw, Ann
dc.contributor.author	Flinn, P. A.
dc.contributor.author	Maex, Karen
dc.contributor.imecauthor	Maex, Karen
dc.date.accessioned	2021-09-29T15:53:43Z
dc.date.available	2021-09-29T15:53:43Z
dc.date.embargo	9999-12-31
dc.date.issued	1996
dc.identifier.uri	https://imec-publications.be/handle/20.500.12860/1660
dc.source.beginpage	519
dc.source.conference	Materials Reliability in Microelectronics VI
dc.source.conferencedate	8/04/1996
dc.source.conferencelocation	San Francisco, CA USA
dc.source.endpage	524
dc.title	The effect of the passivation material on the stress and stress relaxation behaviour of narrow Al-Si-Cu lines
dc.type	Proceedings paper
dspace.entity.type	Publication
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