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Towards Chip-Package-System Co-optimization of Thermally-limited System-On-Chips (SOCs)

 
dc.contributor.authorMishra, Subrat
dc.contributor.authorSankatali, Venkateswarlu
dc.contributor.authorVermeersch, Bjorn
dc.contributor.authorBrunion, Moritz
dc.contributor.authorLofrano, Melina
dc.contributor.authorAbdi, Dawit
dc.contributor.authorOprins, Herman
dc.contributor.authorBiswas, Dwaipayan
dc.contributor.authorZografos, Odysseas
dc.contributor.authorHiblot, Gaspard
dc.contributor.authorVan der Plas, Geert
dc.contributor.authorWeckx, Pieter
dc.contributor.authorHellings, Geert
dc.contributor.authorMyers, James
dc.contributor.authorCatthoor, Francky
dc.contributor.authorRyckaert, Julien
dc.contributor.imecauthorMishra, Subrat
dc.contributor.imecauthorSankatali, Venkateswarlu
dc.contributor.imecauthorVermeersch, Bjorn
dc.contributor.imecauthorBrunion, Moritz
dc.contributor.imecauthorLofrano, Melina
dc.contributor.imecauthorAbdi, Dawit
dc.contributor.imecauthorOprins, Herman
dc.contributor.imecauthorBiswas, Dwaipayan
dc.contributor.imecauthorZografos, Odysseas
dc.contributor.imecauthorHiblot, Gaspard
dc.contributor.imecauthorVan der Plas, Geert
dc.contributor.imecauthorWeckx, Pieter
dc.contributor.imecauthorHellings, Geert
dc.contributor.imecauthorMyers, James
dc.contributor.imecauthorCatthoor, Francky
dc.contributor.imecauthorRyckaert, Julien
dc.contributor.orcidimecMishra, Subrat::0000-0002-1435-3275
dc.contributor.orcidimecSankatali, Venkateswarlu::0000-0002-1616-6764
dc.contributor.orcidimecVermeersch, Bjorn::0000-0001-8640-672X
dc.contributor.orcidimecBrunion, Moritz::0000-0001-7842-7774
dc.contributor.orcidimecLofrano, Melina::0000-0002-3930-6459
dc.contributor.orcidimecAbdi, Dawit::0000-0002-3598-8798
dc.contributor.orcidimecOprins, Herman::0000-0003-0680-4969
dc.contributor.orcidimecBiswas, Dwaipayan::0000-0002-1087-3433
dc.contributor.orcidimecZografos, Odysseas::0000-0002-9998-8009
dc.contributor.orcidimecHiblot, Gaspard::0000-0002-3869-965X
dc.contributor.orcidimecVan der Plas, Geert::0000-0002-4975-6672
dc.contributor.orcidimecHellings, Geert::0000-0002-5376-2119
dc.contributor.orcidimecCatthoor, Francky::0000-0002-3599-8515
dc.date.accessioned2024-05-07T08:58:58Z
dc.date.available2023-07-15T17:05:28Z
dc.date.available2024-05-07T08:58:58Z
dc.date.issued2023
dc.identifier.doi10.1109/IRPS48203.2023.10117979
dc.identifier.eisbn978-1-6654-5672-2
dc.identifier.issn1541-7026
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/42147
dc.publisherIEEE
dc.source.conference61st IEEE International Reliability Physics Symposium (IRPS)
dc.source.conferencedateMAR 26-30, 2023
dc.source.conferencelocationMonterey
dc.source.journalN/A
dc.source.numberofpages7
dc.title

Towards Chip-Package-System Co-optimization of Thermally-limited System-On-Chips (SOCs)

dc.typeProceedings paper
dspace.entity.typePublication
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