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Scanning electron microscopy-based automatic defect inspection for semiconductor manufacturing: a systematic review

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cris.virtual.orcid0000-0003-4308-0381
cris.virtual.orcid0000-0001-9021-2469
cris.virtual.orcid0000-0002-0886-137X
cris.virtualsource.department88d4cdb2-8ec4-4aa4-87ee-9719850d7416
cris.virtualsource.departmentbf0a7c89-b35e-4250-9176-f7cfcafb8058
cris.virtualsource.department618c7dcf-d19e-467b-8ef0-ea4d90b44eb8
cris.virtualsource.orcid88d4cdb2-8ec4-4aa4-87ee-9719850d7416
cris.virtualsource.orcidbf0a7c89-b35e-4250-9176-f7cfcafb8058
cris.virtualsource.orcid618c7dcf-d19e-467b-8ef0-ea4d90b44eb8
dc.contributor.authorDehaerne, Enrique
dc.contributor.authorDey, Bappaditya
dc.contributor.authorBlanco, Victor
dc.contributor.authorDavis, Jesse
dc.contributor.imecauthorDehaerne, Enrique
dc.contributor.imecauthorDey, Bappaditya
dc.contributor.imecauthorBlanco, Victor
dc.contributor.orcidimecDehaerne, Enrique::0000-0001-9021-2469
dc.contributor.orcidimecDey, Bappaditya::0000-0002-0886-137X
dc.contributor.orcidimecBlanco, Victor::0000-0003-4308-0381
dc.date.accessioned2025-08-03T03:58:49Z
dc.date.available2025-08-03T03:58:49Z
dc.date.issued2025-APR 1
dc.description.wosFundingTextWe thank the reviewers for their valuable feedback, which has significantly improved this review paper. Jesse Davis acknowledges the funding from the Flemish Government under the "Onderzoeksprogramma Artificiele Intelligentie (AI) Vlaanderen" program. Microsoft 365 Copilot Chat was utilized to provide language and grammar correction suggestions throughout this manuscript. All outputs generated by the model were manually verified before being included in the final version.
dc.identifier.doi10.1117/1.JMM.24.2.020901
dc.identifier.issn1932-5150
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/46024
dc.publisherSPIE-SOC PHOTO-OPTICAL INSTRUMENTATION ENGINEERS
dc.source.beginpage020901-1
dc.source.endpage020901-28
dc.source.issue2
dc.source.journalJOURNAL OF MICRO-NANOPATTERNING MATERIALS AND METROLOGY-JM3
dc.source.numberofpages28
dc.source.volume24
dc.subject.keywordsNEURAL-NETWORK APPROACH
dc.subject.keywordsCLASSIFICATION
dc.subject.keywordsCONTRAST
dc.subject.keywordsVOLTAGE
dc.title

Scanning electron microscopy-based automatic defect inspection for semiconductor manufacturing: a systematic review

dc.typeJournal article
dspace.entity.typePublication
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