Publication:

Improving defectivity for III-V CMP processes for <10 nm technology nodes

Date

2014
Proceedings Paper
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dc.contributor.authorTeugels, Lieve
dc.contributor.authorOng, Patrick
dc.contributor.authorBoccardi, Guillaume
dc.contributor.authorWaldron, Niamh
dc.contributor.authorUsman Ibrahim, Ansar
dc.contributor.authorSiebert, Joerg Max
dc.contributor.authorLeunissen, Leonardus A.H.
dc.contributor.imecauthorTeugels, Lieve
dc.contributor.imecauthorOng, Patrick
dc.contributor.imecauthorBoccardi, Guillaume
dc.contributor.imecauthorWaldron, Niamh
dc.contributor.imecauthorUsman Ibrahim, Ansar
dc.contributor.orcidimecTeugels, Lieve::0000-0002-6613-9414
dc.contributor.orcidimecOng, Patrick::0000-0002-2072-292X
dc.contributor.orcidimecBoccardi, Guillaume::0000-0003-3226-4572
dc.date.accessioned2021-10-22T06:30:51Z
dc.date.available2021-10-22T06:30:51Z
dc.date.issued2014
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/24609
dc.source.beginpagena
dc.source.conferenceInternational Conference on Planarization/CMP Technology
dc.source.conferencedate19/11/2014
dc.source.conferencelocationKobe Japan
dc.title

Improving defectivity for III-V CMP processes for <10 nm technology nodes

dc.typeProceedings paper
dspace.entity.typePublication
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