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Improved chip & component encapsulation by dedicated diffusion barriers to reduce corrosion sensitivity in biological and humid environments
Publication:
Improved chip & component encapsulation by dedicated diffusion barriers to reduce corrosion sensitivity in biological and humid environments
Date
2013
Proceedings Paper
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Op de Beeck, Maaike
;
Jarboui, Ahmed
;
Cauwe, Maarten
;
Declercq, Heidi
;
Uytterhoeven, Griet
;
Cornelissen, Maria
;
Vanfleteren, Jan
;
Van Hoof, Chris
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1894
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Acq. date: 2025-12-06
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Views
1894
since deposited on 2021-10-21
1
last month
1
last week
Acq. date: 2025-12-06
Citations