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Study of the impact of thin wafer shipment on the electrical performance of active devices

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dc.contributor.authorJourdain, Anne
dc.contributor.imecauthorJourdain, Anne
dc.date.accessioned2021-10-23T11:34:59Z
dc.date.available2021-10-23T11:34:59Z
dc.date.issued2016
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/26790
dc.source.beginpage4
dc.source.endpage5
dc.source.issueJuly
dc.source.journalEntegris Newsletter
dc.title

Study of the impact of thin wafer shipment on the electrical performance of active devices

dc.typeJournal article
dspace.entity.typePublication
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